DL-1200/RTU 模块化通信设备 是电子产品的关键电子互连件

嵌入式和边缘计算技术的供应商德国康佳特宣布推出新款COM-HPC Client计算机模块，该模块基于3代英特尔酷睿处理器的高端版本。与现有采用焊接式处理器的高性能COM-HPC模块产品不同，新品采用了比同世代处理器具备更加强大性能的插槽封装。新款conga-HPC/cRLS计算机模块为COM-HPC Size C尺寸（120x160mm），DL-1200/RTU   模块化通信设备  适用于需要出色的多核与多线程性能、大缓存、大内存、大带宽和先进I/O技术的应用领域。其目标市场包括性能需求高的工业、医疗和需要人工智能(AI）和机器学习(ML）能力的边缘类应用，以及各类需要集成负载的嵌入式和边缘计算方案。此外，康佳特还支持Real-Time Systems公司的实时系统管理程序(Hypervisor)技术。

　　康佳特产品经理Jürgen Jungbauer表示：“凭借多可达8个 性能核与16个能效核，基于3代英特尔酷睿处理器的插槽版本，使我们的COM HPC模块能够提供更多选择，DL-1200/RTU   模块化通信设备  通过负载整合让边缘计算更加高性能和高效。”连接物联网的系统需要并行处理许多任务，如果OEM厂商不希望通过适应性系统来实现，就需要将虚拟机嵌入到其方案中。计算机模块的核心越多，这一切就越容易实现。

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DL-1200/RTU   模块化通信设备

When we open the keyboard of a general-purpose computer, we can see a soft film (flexible insulation substrate) printed with silver white (silver paste) conductive patterns and health patterns. We refer to this type of printed circuit board as a flexible silver paste printed circuit board because it is obtained through the universal screen leakage method. And the various computer motherboards, graphics cards, network cards, modems, sound cards, and printed circuit boards on household appliances we see in the computer city are different. The substrate used is made of paper based (commonly used on one side) or glass cloth based (commonly used on both sides and multiple layers), pre impregnated with phenolic or epoxy resin, coated with copper sheets on the surface or both sides, and then laminated and cured. This type of circuit board is called a rigid board, which is covered with copper sheets. To make a printed circuit board again, we call it a rigid printed circuit board. A printed circuit board with printed circuit graphics on one side is called a single sided printed circuit board, and a printed circuit board with printed circuit graphics on both sides is formed by double-sided interconnection through hole metallization, which is called a double-sided board. If a printed circuit board with one double-sided inner layer, two single-sided outer layers, or two double-sided inner layers, and two single-sided outer layers is used, the printed circuit board that is interconnected in a conductive pattern according to the design requirements through a positioning system and insulation bonding material alternately becomes a four or six layer printed circuit board, also known as a multi-layer printed circuit board. There are now over 100 layers of practical printed circuit boards.
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